Datasheet
1516
Exposed
Thermal Pad*
VOS
PGND
1
2
SW
SW
3
4
DEF
PG
1314
PGND
EN
6
5
7 8
12
11
10
9
FB
AGND
CP
CN
PVIN
AVIN
SS
PVIN
TLV62090
SLVSBB9B –MARCH 2012–REVISED APRIL 2012
www.ti.com
DEVICE INFORMATION
16 PIN 3x3mm QFN
TOP VIEW
NOTE: *The exposed Thermal Pad is connected to AGND.
PIN FUNCTIONS
PIN
I/O DESCRIPTION
NAME NO.
SW 1, 2 I Switch pin of the power stage.
DEF 3 I This pin is used for internal logic and needs to be pulled high. This pin should not be left floating.
Power good open drain output. This pin is high impedance if the output voltage is within regulation. This pin is
PG 4 O pulled low if the output is below its nominal value. The pull up resistor can not be connected to any voltage
higher than the input voltage of the device.
FB 5 Feedback pin of the device.
AGND 6 Analog ground.
CP 7 Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
CN 8 Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
Soft-start control pin. A capacitor is connected to this pin and sets the softstart time. Leaving this pin floating
SS 9 I
sets the minimum start-up time.
AVIN 10 Bias supply input voltage pin.
PVIN 11,12 Power supply input voltage pin.
Device enable. To enable the device this pin needs to be pulled high. Pulling this pin low disables the device.
EN 13
This pin has an active pull down resistor of typically 400 kΩ.
PGND 14,15 Power ground connection.
VOS 16 Output voltage sense pin. This pin needs to be connected to the output voltage.
Thermal Pad The exposed thermal pad is connected to AGND.
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