Datasheet
TLV62080, TLV62084
www.ti.com
SLVSAK9E –OCTOBER 2011–REVISED FEBRUARY 2014
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
VIN, PG, VOS
(2)
–0.3 7 V
SW
(2)(3)
–0.3 V
IN
+ 0.3 V
Voltage range
FB
(2)
–0.3 3.6 V
EN
(2)
–0.3 V
IN
+ 0.3 V
Operating junction temperature range, T
J
–40 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) During operation, device switching.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM) ESD stress voltage
(2)
2 kV
V
ESD
(1)
Charged device model (CDM) ESD stress voltage
(3)
500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe
manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
MIN TYP MAX UNIT
V
IN
Input voltage range, TLV62080 2.5 5.5 V
V
IN
Input voltage range, TLV62084 2.7 5.5 V
T
A
Operating ambient temperature –40 85 °C
T
J
Operating junction temperature –40 125 °C
(1) Refer to the Application Information section for further information.
7.4 Thermal Information
TLV6208x
THERMAL METRIC
(1)
DSG UNITS
(8 TERMINALS)
θ
JA
Junction-to-ambient thermal resistance 59.7
θ
JCtop
Junction-to-case (top) thermal resistance 70.1
θ
JB
Junction-to-board thermal resistance 30.9
°C/W
ψ
JT
Junction-to-top characterization parameter 1.4
ψ
JB
Junction-to-board characterization parameter 31.5
θ
JCbot
Junction-to-case (bottom) thermal resistance 8.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: TLV62080 TLV62084