Datasheet

TLV62080, TLV62084

www.ti.com

SLVSAK9E –OCTOBER 2011–REVISED FEBRUARY 2014

11.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

• Improving the power dissipation capability of the PCB design.

• Improving the thermal coupling of the component to the PCB by soldering the Thermal Pad.

• Introducing airflow in the system.

For more details on how to use the thermal parameters, see the Thermal Characteristics application notes

SZZA017 and SPRA953.

Product Folder Links: TLV62080 TLV62084