Datasheet

V
IN
V
OUT
GND
L
C
IN
C
OUT
R1R2
C
FF
GND
Enable Mode
TLV62065
www.ti.com SLVSAC4A –NOVEMBER 2010–REVISED JULY 2012
LAYOUT CONSIDERATIONS
Figure 24. PCB Layout
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI and thermal problems. It is critical to provide a low inductance, impedance ground path. Therefore, use
wide and short traces for the main current paths. The input capacitor should be placed as close as possible to
the IC pins as well as the inductor and output capacitor.
Connect the AGND and PGND Pins of the device to the PowerPAD™ land of the PCB and use this pad as a star
point. Use a common Power PGND node and a different node for the Signal AGND to minimize the effects of
ground noise. The FB divider network should be connected right to the output capacitor and the FB line must be
routed away from noisy components and traces (e.g., SW line).
Due to the small package of this converter and the overall small solution size, the thermal performance of the
PCB layout is important. For good thermal performance a four or more Layer PCB design is recommended. The
PowerPAD of the IC must be soldered on the power pad area on the PCB to achieve proper thermal connection.
Additionally, for good thermal performance, the PowerPAD on the PCB needs to be connected to an inner GND
plane with sufficient via connections. See the documentation of the evaluation kit.
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