Datasheet

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Serial
Interface
and
Control
12-Bit
DAC B
Latch
SCLK
DIN
CS
OUTA
Power-On
Reset
x2
12
2-Bit
Control
Latch
Power
and Speed
Control
2
Voltage
Bandgap
PGA With
Output Enable
12-Bit
DAC A
Latch
12
REF AGND V
DD
2
12 12
OUTB
x2
Buffer
12
TLV5638
SLAS225C – JUNE 1999 – REVISED JANUARY 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PACKAGE
T
A
SOIC CERAMIC DIP 20 PAD LCCC
(D) (JG) (FK)
0°C to 70°C TLV5638CD — —
40°C to 85°C TLV5638ID — —
TLV5638QD
40°C to 125°C — —
TLV5638QDR
55°C to 125°C — TLV5638MJG TLV5638MFK
FUNCTIONAL BLOCK DIAGRAM
2