Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
TLV5636CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5636C
TLV5636CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5636C
TLV5636CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AJF
TLV5636CDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AJF
TLV5636CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AJF
TLV5636CDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AJF
TLV5636CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5636C
TLV5636CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5636C
TLV5636ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5636I
TLV5636IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5636I
TLV5636IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AJG
TLV5636IDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AJG
TLV5636IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AJG
TLV5636IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AJG
TLV5636IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5636I
TLV5636IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5636I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.