Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
6-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Samples
(Requires Login)
TLV5619CDW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CDWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CDWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CPW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CPWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619CPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IDW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IDWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IDWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IPW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IPWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619IPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5619QDW OBSOLETE SOIC DW 20 TBD Call TI Call TI