Datasheet

TLV5614

2.7-V TO 5.5-V 12-BIT 3-µS QUADRUPLE DIGITAL-TO-ANALOG CONVERTERS

WITH POWER DOWN

SLAS188B – SEPTEMBER 1998 – REVISED APRIL 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

APPLICATION INFORMATION

In power-down mode, all amplifiers within the TLV5614 are disabled. A particular DAC (A, B, C, D) of the

TLV5614 is selected by A1 and A0 within the input word.

A1 A0 DAC

0 0 A

0 1 B

1 0 C

1 1 D

Using TLV5614IYE, Bumped Dice

D Melting point of eutectic solder is 183°C.

D Recommended peak reflow temperatures are in the 220°C to 230°C range.

D The use of underfill is required. The use of underfill greatly reduces the risk of thermal mismatch fails.

Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board

level/system level reliability. The process is to dispense the epoxy under the dice after die attach reflow. The

epoxy adheres to the body of the device and to the printed-circuit board. It reduces stress placed upon the solder

joints due to the thermal coefficient of expansion (TCE) mismatch between the board and the component.

Underfill material is highly filled with silica or other fillers to increase an epoxy’s modulus, reduce creep

sensitivity, and decrease the material’s TCE.

The recommendation for peak flow temperatures of 220°C to 230°C is based on general empirical results that

indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or

circuit board pad. Lower peak temperatures may cause nonwets (cold solder joints).

NOTE A: All linear dimensions are in millimeters.

NOTE B: This drawing is subject to change without notice.

NOTE C: Scale = 18x

Figure 17. TLV5614IYE Bumped Dice