Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
TLV5606CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5606C
TLV5606CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5606C
TLV5606CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AGX
TLV5606CDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AGX
TLV5606CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AGX
TLV5606CDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 AGX
TLV5606CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5606C
TLV5606CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 5606C
TLV5606ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5606I
TLV5606IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5606I
TLV5606IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AGY
TLV5606IDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AGY
TLV5606IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AGY
TLV5606IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 AGY
TLV5606IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5606I
TLV5606IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 5606I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.