Datasheet

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SLOS310B − DECEMBER 2000 − REVISED SEPTEMBER 2006
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations
The TLV4120 is available in a thermally-enhanced PowerPAD package. This package is constructed using a
downset leadframe upon which the die is mounted [see Figure 25(a) and Figure 25(b)]. This arrangement results
in the lead frame being exposed as a thermal pad on the underside of the package [see Figure 25(c)]. Because
this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by
providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
Soldering the PowerPAD to the PCB is always recommended, even with applications that have low-power
dissipation. This provides the necessary connection between the lead frame die pad and the PCB.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with mechanical heatsinking methods.
DIE
Side View (a)
End View (b) Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 25. Views of Thermally-Enhanced DGN Package