Datasheet

TLV3501-Q1

SBOS533A –SEPTEMBER 2010–REVISED SEPTEMBER 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

(1)

PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR

(2)

PACKAGE MARKING

TLV3501AQDBVRQ1 SOT23-6 DBV VCBQ

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

TLV3501-Q1 UNIT

Supply voltage 5.5 V

Signal input terminal voltage

(2)

(V−) − 0.3 to (V+) + 0.3 V

Signal input terminal current

(2)

10 mA

Output short-circuit current

(3)

74 mA

Thermal impedance, junction to free air 200 °C/W

Operating temperature −40 to +125 °C

Storage temperature −65 to +150 °C

Junction temperature 150 °C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should

be current limited to 10mA or less.

(3) Short circuit to ground, one comparator per package

Product Folder Link(s): TLV3501-Q1