Datasheet

TLV320DAC3101
www.ti.com SLAS666A –JANUARY 2010–REVISED MAY 2012
Table 2-1. TERMINAL FUNCTIONS (continued)
TERMINAL
I/O DESCRIPTION
NAME NO.
MICBIAS 12 – Microphone bias for external microphone
NC 4,15 I No connecton
RESET 31 I Device reset
SCL 10 I/O I
2
C control bus clock input
SDA 9 I/O I
2
C control bus data input
SPLM 19 O Left-channel class-D speaker-driver inverting output
SPLP 22 O Left-channel class-D speaker-driver noninverting output
SPLVDD 21 – Left-channel class-D speaker-driver power supply
SPLVSS 20 – Left-channel class-D speaker-driver power supply ground
SPRM 23 O Right-channel class-D speaker-driver inverting output
SPRP 26 O Right-channel class-D speaker-driver noninverting output
SPRVDD 24 – Right-channel class-D speaker-driver power supply
SPRVSS 25 – Right-channel class-D speaker-driver power-supply ground
Volume control or headphone detection. Note that microphone detection is also available on
VOL/MICDET 11 I
devices that have an ADC.
WCLK 6 I/O Audio serial word clock
3 ELECTRICAL SPECIFICATIONS
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
AVDD to AVSS –0.3 to 3.9 V
DVDD to DVSS –0.3 to 2.5 V
HPVDD to HPVSS –0.3 to 3.9 V
SPLVDD to SPLVSS –0.3 to 6 V
SPRVDD to SPRVSS –0.3 to 6 V
IOVDD to IOVSS –0.3 to 3.9 V
Digital input voltage IOVSS – 0.3 to IOVDD + 0.3 V
Analog input voltage AVSS – 0.3 to AVDD + 0.3 V
Operating temperature range –40 to 85 °C
Storage temperature range –55 to 150 °C
Junction temperature (T
J
Max) 105 °C
Power dissipation (T
J
Max – T
A
)/R
θJA
W
R
θJA
thermal impedance (with thermal pad soldered to board) 35 °C/W
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3-1. System Thermal Characteristics
(1)
Power Rating at 25°C Derating Factor Power Rating at 70°C Power Rating at 85°C
2.3 W 28.57 mW/°C 1 W 0.6 W
(1) This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer 3-in. × 3-
in. (7.62-cm × 7.62-cm) PCB.
Copyright © 2010–2012, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 5
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