Datasheet

PIN ASSIGNMENTS
A
1 2 3 4
5
6
7
8 9
B
C
D
E
F
G
H
J
48−leadQFNPackage(Bottomview) 5x5mm80−BallBGA Package(BottomView)
48
1
12
13
24
25
36
37
(Nottoscale) =NC
TLV320AIC33
www.ti.com ........................................................................................................................................... SLAS480B – JANUARY 2006 – REVISED DECEMBER 2008
PACKAGING/ORDERING INFORMATION
PACKAGE OPERATING ORDERING TRANSPORT
PRODUCT PACKAGE DESIGNATOR TEMPERATURE NUMBER MEDIA, QUANTITY
RANGE
TLV320AIC33IZQE Trays, 360
ZQE
TLV320AIC33IZQER Tape and Reel, 3000
BGA-80
TLV320AIC33IGQE Trays, 360
TLV320AIC33 GQE – 40 ° C to 85 ° C
TLV320AIC33IGQER Tape and Reel, 3000
TLV320AIC33IRGZT Tape and Reel, 250
QFN-48 RGZ
TLV320AIC33IRGZR Tape and Reel, 2000
Connect QFN thermal pad to DRVSS.
The shaded balls on BGA package are not connected to the die, but are electrically connected to each other.
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
BGA
QFN NAME
BALL
A2 13 MICBIAS Microphone Bias Voltage Output
A1 14 MIC3R MIC3 Input (Right or Multifunction)
C2,D2 15 AVSS_ADC Analog ADC Ground Supply, 0 V
B1,C1 16,17 DRVDD ADC Analog and Output Driver Voltage Supply, 2.7 V – 3.6 V
D1 18 HPLOUT High-Power Output Driver (Left Plus)
E1 19 HPLCOM High-Power Output Driver (Left Minus or Multifunctional)
E2,F2 20,21 DRVSS Analog Output Driver Ground Supply, 0 V
F1 22 HPRCOM High-Power Output Driver (Right Minus or Multifunctional)
G1 23 HPROUT High-Power Output Driver (Right Plus)
H1 24 DRVDD ADC Analog and Output Driver Voltage Supply, 2.7 V – 3.6 V
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