Datasheet

MICDET
VNEG
FLY_N
DVss_CP
DVdd (40)
SCLK/MFP3
SCL/SSZ
SDA/MOSI
MISO/MFP4
SPI_SELECT
IN1_L
IN1_R
DIN/MFP1 WCLK BCLK MCLK GPIO/MFP5 DVss
LOR LOL IN3_R IN3_L MICBIAS REF AVss
FLY_P
DOUT/MFP2
IOVss
GND_Sense
IN2_L
IN2_R
AVdd
Vsys
DRVDD_HP
HPR
HPL
DVdd_CP
Reset DVss (1)
IOVdd
TLV320AIC3256
www.ti.com SLOS630B –DECEMBER 2010–REVISED JANUARY 2013
Package and Signal Descriptions
Packaging/Ordering Information
PRODUCT PACKAGE PACKAGE OPERATING ORDERING TRANSPORT MEDIA,
DESIGNATOR TEMPERATURE NUMBER QUANTITY
RANGE
TLV320AIC3256 QFN RSB –40°C to 85°C TLV320AIC3256IRSBT Tape and Reel, 250
TLV320AIC3256IRSBR Tape and Reel, 3000
TLV320AIC3256 WCSP YZF –40°C to 85°C TLV320AIC3256IYZFT Tape and Reel, 250
(DSBGA)
TLV320AIC3256IYZFR Tape and Reel, 3000
Pin Assignments
Figure 2. QFN (RSB) Package, Bottom View Figure 3. WCSP (YZF) Package, Bottom View
(Preview)
Table 1. TERMINAL FUNCTIONS
5x5mm 40-
WCSP
PIN QFN
(YZF) NAME TYPE DESCRIPTION
(RSB) PIN
BALL NO.
NO.
1 B2 DVss GND Digital ground. Device substrate.
2 A1 DVss GND Digital ground
3 C5 RESET I Hardware reset
4 B3 GPIO I/O Primary function:
General purpose digital IO
MFP5 Secondary function:
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