Datasheet

TLV320AIC3204
www.ti.com SLOS602B –SEPTEMBER 2008–REVISED OCTOBER 2012
THERMAL INFORMATION
TLV320AIC3204
THERMAL METRIC
(1)
UNIT
RHB (32 PINS)
θ
JA
Junction-to-ambient thermal resistance 31.4
θ
JCtop
Junction-to-case (top) thermal resistance 21.4
θ
JB
Junction-to-board thermal resistance 5.4
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2
ψ
JB
Junction-to-board characterization parameter 5.4
θ
JCbot
Junction-to-case (bottom) thermal resistance 0.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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