Datasheet
TLV320AIC3110
www.ti.com
SLAS647B –DECEMBER 2009–REVISED MAY 2012
Table 2-1. TERMINAL FUNCTIONS (continued)
TERMINAL
I/O DESCRIPTION
NAME NO.
MIC1LM 15 I Microphone/line input routed to M or P input mixer
MIC1LP 13 I Microphone/line input routed to P input mixer and left output mixer
MIC1RP 14 I Microphone/line input routed to P input mixer and left/right output mixer
RESET 31 I Device reset
SCL 10 I/O I
2
C control bus clock input
SDA 9 I/O I
2
C control bus data input
SPLM 19 O Left-channel class-D speaker-driver inverting output
SPLP 22 O Left-channel class-D speaker-driver noninverting output
SPLVDD 21 – Left-channel class-D speaker-driver power supply
SPLVSS 20 – Left-channel class-D speaker-driver power supply ground
SPRM 23 O Right-channel class-D speaker-driver inverting output
SPRP 26 O Right-channel class-D speaker-driver noninverting output
SPRVDD 24 – Right-channel class-D speaker-driver power supply
SPRVSS 25 – Right-channel class-D speaker-driver power-supply ground
VOL/MICDET 11 I Volume control or microphone detection
WCLK 6 I/O Audio serial word clock
3 ELECTRICAL SPECIFICATIONS
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
AVDD to AVSS –0.3 to 3.9 V
DVDD to DVSS –0.3 to 2.5 V
HPVDD to HPVSS –0.3 to 3.9 V
SPLVDD to SPLVSS –0.3 to 6 V
SPRVDD to SPRVSS –0.3 to 6 V
IOVDD to IOVSS –0.3 to 3.9 V
Digital input voltage IOVSS – 0.3 to IOVDD + 0.3 V
Analog input voltage AVSS – 0.3 to AVDD + 0.3 V
Operating temperature range –40 to 85 °C
Storage temperature range –55 to 150 °C
Junction temperature (T
J
Max) 105 °C
Power dissipation (T
J
Max – T
A
)/R
θJA
W
Thermal impedance (with thermal pad soldered to board), R
θJA
35 °C/W
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3-1. System Thermal Characteristics
(1)
Power Rating at 25°C Derating Factor Power Rating at 70°C Power Rating at 85°C
2.3 W 28.57 mW/°C 1 W 0.6 W
(1) This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer 3-in. × 3-
in. (7.62-cm × 7.62-cm) PCB.
Copyright © 2009–2012, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 5
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