Datasheet
TLV320AIC3100
www.ti.com
SLAS667A –NOVEMBER 2009–REVISED MAY 2012
Table 2-1. TERMINAL FUNCTIONS (continued)
TERMINAL
I/O DESCRIPTION
NAME NO.
MIC1LM 15 I Microphone/line input routed to M or P input mixer
MIC1LP 13 I Microphone/line input routed to P input mixer and left output mixer
MIC1RP 14 I Microphone/line input routed to P input mixer and left/right output mixer
RESET 31 I Device reset
SCL 10 I/O I
2
C control bus clock input
SDA 9 I/O I
2
C control bus data input
SPKM 19, 23 O Class-D speaker driver inverting output
SPKP 22, 26 O Class-D speaker driver noninverting output
SPKVDD 21 – Class-D speaker driver power supply
SPKVSS 20 – Class-D speaker driver power supply ground
SPKVDD 24 – Class-D speaker driver power supply
SPKVSS 25 – Class-D speaker driver power supply ground
VOL/MICDET 11 I Volume control or microphone / headphone / headset detection
WCLK 6 I/O Audio serial word clock
3 ELECTRICAL SPECIFICATIONS
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
AVDD to AVSS –0.3 to 3.9 V
DVDD to DVSS –0.3 to 2.5 V
HPVDD to HPVSS –0.3 to 3.9 V
SPKVDD to SPKVSS –0.3 to 6 V
IOVDD to IOVSS –0.3 to 3.9 V
Digital input voltage IOVSS – 0.3 to IOVDD + 0.3 V
Analog input voltage AVSS – 0.3 to AVDD + 0.3 V
Operating temperature range –40 to 85 °C
Storage temperature range –55 to 150 °C
Junction temperature (T
J
Max) 105 °C
Power dissipation (T
J
Max – T
A
)/R
θJA
W
QFN package
R
θJA
thermal impedance (with thermal pad soldered to board) 35 °C/W
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3-1. System Thermal Characteristics
(1)
Power Rating at 25°C Derating Factor Power Rating at 70°C Power Rating at 85°C
2.3 W 28.57 mW/°C 1 W 0.6 W
(1) This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer 3-in. × 3-
in. (7.62-cm × 7.62-cm) PCB.
Copyright © 2009–2012, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 5
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