Datasheet


SLAS412− DECEMBER 2003
www.ti.com
3
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)(2)
UNITS
AVDD to AVSS −0.3 V to 3.9 V
DRVDD to DRVSS −0.3 V to 3.9 V
IOVDD to DVSS −0.3 V to 3.9 V
DVDD to DVSS −0.3 V to 2.5 V
AVDD to DRVDD −0.1 V to 0.1 V
AVSS to DRVSS to DVSS −0.1 V to 0.1 V
Analog inputs (except VBAT1 and VBAT2) to AVSS −0.3 V to AVDD + 0.3 V
VBAT1 / VBAT2 to AVSS −0.3 V to 6 V
Digital input voltage to DVSS −0.3 V to IOVDD + 0.3 V
Operating temperature range −40°C to 85°C
Storage temperature range −65°C to 105°C
Junction temperature (T
J
Max) 105°C
QFN package
Power dissipation (T
J
Max − T
A
)/θ
JA
QFN package
θ
JA
Thermal impedance 123°C/W
Lead temperature
Soldering vapor phase (60 sec) 215°C
Lead temperature
Infrared (15 sec) 220°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If the ’AIC26 is used to drive high power levels to an 8-Ω load for extended intervals at ambient temperatures above 70°C, multiple vias should be
used to electrically and thermally connect the thermal pad on the QFN package to an internal heat-dissipating ground plane on the user’s PCB.