Datasheet
SLAS412− DECEMBER 2003
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE
PACKAGE
DESIGNATOR
OPERATING
TEMPERATURE RANGE
ORDERING NUMBER
TRANSPORT MEDIA,
QUANTITY
TLV320AIC26
QFN-32
RHB
−40°C to 85°C
TLV320AIC26IRHB Tubes, 74
TLV320AIC26
QFN-32
RHB
−40
°
C to 85
°
C
TLV320AIC26IRHBR Tape and Reel, 3000
PIN ASSIGNMENTS
QFN(TOP VIEW)
31 30 29 28 27
910
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
DRVDD
VGND
DRVSS
HPL
AVDD
NC
NC
NC
DVSS
IOVDD
MCLK
SCLK
MISO
MOSI
SS
DAV
32 26
11 12 13 14 15
MICBIAS
MICIN
AUX
VBAT2
AVSS
DVDD
BCLK
DOUT
DIN
PWD/ADWS
LRCK
RESET
16
HPR
25
NC
VBAT1
VREF
AIC26
Terminal Functions
QFN
PIN
NAME DESCRIPTION
QFN
PIN
NAME DESCRIPTION
29 DIN Audio data input 13 VBAT1 Battery monitor input
30 DOUT Audio data output 14 VREF Reference voltage I/O
31 BCLK Audio bit−clock 15 AVSS Analog ground
32 DVDD Digital core supply 16 NC No connect
1 DVSS Digital core and IO ground 17 NC No connect
2 IOVDD IO supply 18 NC No connect
3 MCLK Master clock 19 NC No connect
4 SCLK SPI serial clock input 20 AVDD Analog power supply
5 MISO SPI serial data output 21 HPL Left channel audio output
6 MOSI SPI serial data input 22 DRVSS Speaker ground
7 SS SPI slave select input 23 VGND Virtual ground for audio output
8 DAV Auxiliary data available output 24 DRVDD Speaker /PLL supply
9 MICBIAS Microphone bias voltage 25 HPR Right channel audio output
10 MICIN Microphone input 26 RESET Device reset
11 AUX Auxiliary input 27 LRCK Audio DAC word-clock
12 VBAT2 Battery monitor input 28 PWD/ADWS Hardware powerdown/ADC word clock