Datasheet
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
TLV320ADC3101
SLAS553A – NOVEMBER 2008 – REVISED SEPTEMBER 2009 ......................................................................................................................................
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PIN FUNCTIONS (continued)
PIN
NAME NUMBER DESCRIPTION
I2C_ADR0 15 LSB of I
2
C bus address
I2C_ADR1 16 LSB + 1 of I
2
C bus address
IN1L(P) 8 Mic or line analog input (left-channel single-ended or differential plus, or right channel)
IN1R(M) 11 Mic or line analog input (left-channel single-ended or differential minus, or left channel)
IN2L(P) 7 Mic or line analog input (left-channel single-ended or differential plus)
IN2R(P) 12 Mic or line analog input (right-channel single-ended or differential plus)
IN3L(M) 6 Mic or line analog input (left-channel single-ended or differential minus)
IN3R(M) 13 Mic or line analog input (right-channel single-ended or differential minus)
IOVDD 21 I/O voltage supply, 1.1 V – 3.6 V
MCLK 24 Master clock input
MICBIAS1 5 MICBIAS1 bias voltage output
MICBIAS2 14 MICBIAS2 bias voltage output
RESET 4 Reset
SCL 17 I
2
C serial clock
SDA 18 I
2
C serial data input/output
WCLK 2 Audio serial data bus word clock (input/output)
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
AVDD to AVSS – 0.3 to 3.9 V
IOVDD to DVSS – 0.3 to 3.9 V
DVDD to DVSS – 0.3 to 2.5 V
Digital input voltage to DVSS – 0.3 V to IOVDD + 0.3 V
Analog input voltage to AVSS – 0.3 V to AVDD + 0.3 V
Operating temperature range – 40 to 85 ° C
T
stg
Storage temperature range – 65 to 125 ° C
T
J
Max Junction temperature 105 ° C
Power dissipation (T
J
Max – T
A
) / θ
JA
W
θ
JA
Thermal impedance, QFN package 45 ° C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) ESD complacence tested to EIA / JESD22-A114-B and passed.
T
A
= 25 ° C T
A
= 75 ° C T
A
= 85 ° C
PACKAGE TYPE DERATING FACTOR
POWER RATING POWER RATING POWER RATING
QFN 1.7 W 22 mW/ ° C 665 mW 444 mW
(1) This data was taken using 2 oz. (0.071-mm thick) trace and copper pad that is soldered directly to a JEDEC standard 4-layer
3-in. × 3-in. (7.62-cm × 7.62-cm) PCB.
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