Datasheet
1
2
3
4
8
7
6
5
V
CC
2OUT
2IN-
2IN+
1OUT
1IN-
1IN+
GND
V
CC
IN-
OUT
GND
IN+
1
2
3
5
4
TLV3201
TLV3202
www.ti.com
SBOS561A –MARCH 2012–REVISED JUNE 2012
THERMAL INFORMATION
TLV3201 TLV3202
DBV DCK D DGK
THERMAL METRIC
(1)
UNITS
(SOT23) (SC70) (SOIC) (MSOP)
5 PINS 5 PINS 8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 237.8 281.9 146.3 201.9
θ
JCtop
Junction-to-case (top) thermal resistance 108.7 97.6 97.2 92.5
θ
JB
Junction-to-board thermal resistance 64.1 68.3 84.2 123.3
°C/W
ψ
JT
Junction-to-top characterization parameter 12.1 2.6 45.5 23.0
ψ
JB
Junction-to-board characterization parameter 63.3 67.3 83.7 121.6
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
PIN CONFIGURATIONS
D AND DGK PACKAGES
DCK AND DBV PACKAGES
SOIC-8 AND MSOP-8
SC70-5 AND SOT23-5
(TOP VIEW)
(TOP VIEW)
PIN DESCRIPTIONS: D, DGK
NAME NO. DESCRIPTION
1IN– 2 Negative input, comparator 1
1IN+ 3 Positive input, comparator 1
1OUT 1 Output, comparator 1
2IN– 6 Negative input, comparator 2
2IN+ 5 Positive input, comparator 2
2OUT 7 Output, comparator 2
GND 4 Negative supply, ground
V
CC
8 Positive supply
PIN DESCRIPTIONS: DCK, DBV
NAME NO. DESCRIPTION
OUT 1 Output
GND 2 Negative supply, ground
IN+ 3 Positive input
V
CC
5 Positive supply
IN– 4 Negative input
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