Datasheet

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PACKAGE ORDERING INFORMATION
Pin Configurations
1
2
3
6
5
4
OUT
V–
IN+
V+
REF
IN–
BTV
SOT23-6
TLV3011AMDBV
1
2
3
6
5
4
OUT
V–
IN+
V+
REF
IN–
TBD
SOT23-6
TLV3012AMDBV
(1)
Note:Pin1isdeterminedbyorientingpackagemarkingasshown.
ProductPreview
(1)
TopView
ABSOLUTE MAXIMUM RATINGS
(1)
TLV3011-EP , TLV3012-EP
SGLS349 – OCTOBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP SIDE MARKING
-55 ° C TO 125 ° C DBV-SOT TLV3011AMDBVREP BTV
DBV-SOT TLV3012AMDBVREP
(2)
TBD
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) Product Preview
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 7 V
Voltage
(2)
–0.5 (V+) +0.5 V
Signal input terminals
Current
(2)
± 10 mA
Output short circuit
(3)
Continous
Operating temperature range –55 125 ° C
T
stg
Storage temperature range –65 150 ° C
T
J
Junction temperature 150 ° C
Lead ambient temperature (soldering, 10 s) 300 ° C
ESD rating (Human-Body Model) 2000 V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal.
(3) Short circuit to ground
2
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