Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV27L1CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV27L1CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV27L1IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV27L1IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV27L1IDR SOIC D 8 2500 340.5 338.1 20.6
TLV27L2CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV27L2CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV27L2CDR SOIC D 8 2500 340.5 338.1 20.6
TLV27L2IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV27L2IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV27L2IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2