Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV2784AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TLV2784CPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TLV2784IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TLV2784IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TLV2785CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TLV2785IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TLV2785IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2780CDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TLV2780CDBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TLV2780IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TLV2780IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TLV2780IDR SOIC D 8 2500 367.0 367.0 35.0
TLV2781CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2781CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2781IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2781IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2781IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 2