Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2782CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2782CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2782CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2782IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2782IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2782IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2783CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2783IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2784AIDR SOIC D 14 2500 367.0 367.0 38.0
TLV2784CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2784IDR SOIC D 14 2500 367.0 367.0 38.0
TLV2784IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2785CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV2785IDR SOIC D 16 2500 367.0 367.0 38.0
TLV2785IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 3