Datasheet

 
     
   
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
2
WWW.TI.COM
TLV2770 and TLV2771 AVAILABLE OPTIONS
V
IO
max AT 25°C
PACKAGED DEVICES
T
A
V
IO
max AT 25
°
C
(mV)
SMALL OUTLINE
(D)
SOT-23
(DBV)
MSOP
(DGK)
PLASTIC DIP
(P)
0°C to 70°C 2.5
TLV2770CD
TLV2771CD
—
TLV2771CDBV
TLV2770CDGK
†
—
TLV2770CP
—
−40°C to 125°C
2.5
TLV2770ID
TLV2771ID
—
TLV2771IDBV
TLV2770IDGK
†
—
TLV2770IP
—
−40
°
C to 125
°
C
1.6
TLV2770AID
TLV2771AID
—
—
—
—
TLV2770AIP
—
†
This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
TLV2772 and TLV2773 AVAILABLE OPTIONS
V
IO
max AT 25°C
PACKAGED DEVICES
T
A
V
IO
max AT 25
°
C
(mV)
SMALL OUTLINE
(D)
MSOP
(DGK)
MSOP
(DGS)
PLASTIC DIP
(N)
PLASTIC DIP
(P)
0°C to 70°C 2.5
TLV2772CD
TLV2773CD
TLV2772CDGK
—
—
TLV2773CDGS
—
TLV2773CN
TLV2772CP
—
−40°C to 125°C
2.5
TLV2772ID
TLV2773ID
TLV2772IDGK
—
—
TLV2773IDGS
—
TLV2773IN
TLV2772IP
—
−40°C to 125°C
1.6
TLV2772AID
TLV2773AID
—
—
—
—
—
TLV2773AIN
TLV2772AIP
—
TLV2774 and TLV2775 AVAILABLE OPTIONS
V
IO
max AT 25°C
PACKAGED DEVICES
T
A
V
IO
max AT 25
°
C
(mV)
SMALL OUTLINE
(D)
PLASTIC DIP
(N)
PLASTIC DIP
(P)
TSSOP
(PW)
0°C to 70°C 2.7
TLV2774CD
TLV2775CD
—
TLV2775CN
TLV2774CP
—
TLV2774CPW
TLV2775CPW
−40°C to 125°C
2.7
TLV2774ID
TLV2775ID
—
TLV2775IN
TLV2774IP
—
TLV2774IPW
TLV2775IPW
−40°C to 125°C
2.1
TLV2774AID
TLV2775AID
—
TLV2775AIN
TLV2774AIP
—
TLV2774AIPW
TLV2775AIPW
TLV2772M/Q AND TLV2772AM/Q AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max AT 25°C
(mV)
SMALL
OUTLINE
(D)
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
CERAMIC
FLATPACK
(U)
TSSOP
(PW)
−40°C to 125°C
2.5 TLV2772QD
‡
— — — TLV2772QPW
‡
−40°C to 125°C
1.6 TLV2772AQD
‡
— — — TLV2772AQPW
‡
−55°C to 125°C
2.5 TLV2772MD TLV2772MFK TLV2772MJG TLV2772MU —
−55
°
C to 125
°
C
1.6 TLV2772AMD TLV2772AMFK TLV2772AMJG TLV2772AMU —
‡
Available in tape and reel