Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2760IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TLV2760IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TLV2761IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2761IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2762CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2762CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2762IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2762IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2762IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2763CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2763IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2763IDGSR VSSOP DGS 10 2500 366.0 364.0 50.0
TLV2764CDR SOIC D 14 2500 333.2 345.9 28.6
TLV2764IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2764IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2765CDR SOIC D 16 2500 333.2 345.9 28.6
TLV2765IDR SOIC D 16 2500 333.2 345.9 28.6
TLV2765IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 31-Aug-2013
Pack Materials-Page 2