Datasheet
µ
SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004
2
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FAMILY PACKAGE TABLE
DEVICE
NUMBER OF
PACKAGE TYPES
SHUTDOWN
UNIVERSAL
DEVICE
NUMBER OF
CHANNELS
PDIP SOIC SOT-23 TSSOP MSOP
SHUTDOWN
UNIVERSAL
EVM BOARD
TLV271 1 8 8 5 — — —
Refer to the EVM
TLV272 2 8 8 — — 8 —
Refer to the EVM
Selection Guide
(Lit# SLOU060)
TLV274 4 14 14 — 14 — —
Selection Guide
(Lit# SLOU060)
TLV271 AVAILABLE OPTIONS
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
†
SOT-23
PLASTIC DIP
T
A
25°C
SMALL OUTLINE
(D)
†
(DBV)
‡
SYMBOL
PLASTIC DIP
(P)
0°C to 70°C
5 mV
TLV271CD TLV271CDBV VBHC —
−40°C to 125°C
5 mV
TLV271ID TLV271IDBV VBHI TLV271IP
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV271IDR).
‡
This package is only available taped and reeled. For standard quantities (3,000 pieces per reel), add an R suffix (e.g., TLV270IDBVR). For smaller
quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g., TLV270IDBVT).
TLV272 AVAILABLE OPTIONS
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
§
MSOP
PLASTIC DIP
T
A
25°C
SMALL OUTLINE
(D)
§
(DGK)
§
SYMBOL
PLASTIC DIP
(P)
0°C to 70°C
5 mV
TLV272CD TLV272CDGK AVF —
−40°C to 125°C
5 mV
TLV272ID TLV272IDGK AVG TLV272IP
§
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV272IDR).
TLV274 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
MAX AT 25°C
SMALL OUTLINE
(D)
¶
PLASTIC DIP
(N)
TSSOP
(PW)
¶
0°C to 70°C
5 mV
TLV274CD — TLV274CPW
−40°C to 125°C
5 mV
TLV274ID TLV274IN TLV274IPW
¶
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV274IDR).