Datasheet

www.ti.com
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
TLV2620 AND TLV2621 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
V
IO
max AT
T
A
SOT-23
SMALL OUTLINE
25 ° C
PLASTIC DIP (P)
(D)
(2)
(DBV)
(3)
SYMBOL
TLV2620ID TLV2620IDBV VBAI TLV2620IP
-40 ° C to 125 ° C 3500 µV
TLV2621ID TLV2621IDBV VBBI TLV2621IP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2620IDR).
(3) The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel). For smaller
quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2620IDBVT).
TLV2622 AND TLV2623 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
V
IO
max AT
SMALL MSOP PLASTIC
T
A
PLASTIC
25 ° C
OUTLINE
(2)
DIP
DIP (N)
(DGK)
(2)
SYMBOL (DGS)
(2)
SYMBOL
(D) (P)
TLV2622ID TLV2622IDGK xxTIAKM — — — TLV2622IP
-40 ° C to 125 ° C 3500 µV
TLV2623ID — — TLV2623IDGS xxTIALC TLV2623IN —
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2622IDR).
TLV2624 AND TLV2625 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
V
IO
max
T
A
SMALL OUTLINE PLASTIC DIP TSSOP
AT 25 ° C
(D)
(2)
(N) (PW)
TLV2624ID TLV2624IN TLV2624IPW
-40 ° C to 125 ° C 3500 µV
TLV2625ID TLV2625IN TLV2625IPW
(1) For the most current package and ordering information, see the Package Option Addendum at the
end of this document, or see the TI website at www.ti.com .
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the
part number (e.g., TLV2624IDR).
2