Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2544CDR SOIC D 16 2500 367.0 367.0 38.0
TLV2544CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV2544IDR SOIC D 16 2500 367.0 367.0 38.0
TLV2544IPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV2548CDWR SOIC DW 20 2000 367.0 367.0 45.0
TLV2548CPWR TSSOP PW 20 2000 367.0 367.0 38.0
TLV2548IDWR SOIC DW 20 2000 367.0 367.0 45.0
TLV2548IPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jan-2013
Pack Materials-Page 2