Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2470AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2470CDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TLV2470CDBVT SOT-23 DBV 6 250 180.0 180.0 18.0
TLV2470CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2470IDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TLV2470IDBVT SOT-23 DBV 6 250 180.0 180.0 18.0
TLV2470IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2470IDR SOIC D 8 2500 367.0 367.0 35.0
TLV2471AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2471CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2471CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2471CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2471IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2471IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2471IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2472AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2472CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLV2472CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2472IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLV2472IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2012
Pack Materials-Page 3