Datasheet

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TLV2470 , , TLV2471
TLV2472 , TLV2473
TLV2474 , TLV2475 , TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
TLV2470 and TLV2471 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
SOT23
SMALL OUTLINE (D)
(2)
PLASTIC DIP (P)
(DBV)
(2)
SYMBOL
TLV2470CD TLV2470CDBV VAUC TLV2470CP
0 ° C to +70 ° C
TLV2471CD TLV2471CDBV VAVC TLV2471CP
TLV2470ID TLV2470IDBV VAUI TLV2470IP
TLV2471ID TLV2471IDBV VAVI TLV2471IP
–40 ° C to +125 ° C
TLV2470AID TLV2470AIP
—— ——
TLV2471AID TLV2471AIP
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2470CDR).
TLV2472 AND TLV2473 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
SMALL MSOP MSOP
T
A
PLASTIC DIP PLASTIC DIP
OUTLINE
(N) (P)
(DGN)
(2)
SYMBOL
(3)
(DGQ)
(2)
SYMBOL
(3)
(D)
(2)
TLV2472CD TLV2472CDGN xxTIABU — — — TLV2472CP
0 ° C to +70 ° C
TLV2473CD — — TLV2473CDGQ xxTIABW TLV2473CN —
TLV2472ID TLV2472IDGN xxTIABV — — — TLV2472IP
TLV2473ID — — TLV2473IDGQ xxTIABX TLV2473IN —
–40 ° C to +125 ° C
TLV2472AID — TLV2472AIP
—— —— —— ——
TLV2473AID TLV2473AIN —
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2472CDR).
(3) xx represents the device date code.
TLV2474 and TLV2475 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
SMALL OUTLINE (D)
(2)
PLASTIC DIP (N) TSSOP (PWP)
(2)
TLV2474CD TLV2474CN TLV2474CPWP
0 ° C to +70 ° C
TLV2475CD TLV2475CN TLV2475CPWP
TLV2474ID TLV2474IN TLV2474IPWP
TLV2475ID TLV2475IN TLV2475IPWP
–40 ° C to +125 ° C
TLV2474AID TLV2474AIN TLV2474AIPWP
TLV2475AID TLV2475AIN TLV2475AIPWP
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2474CDR).
2
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