Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2460AIDR SOIC D 8 2500 367.0 367.0 35.0
TLV2460AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2460CDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TLV2460CDBVT SOT-23 DBV 6 250 180.0 180.0 18.0
TLV2460CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2460IDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TLV2460IDBVT SOT-23 DBV 6 250 180.0 180.0 18.0
TLV2460IDR SOIC D 8 2500 367.0 367.0 35.0
TLV2460IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2461AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2461AIDR SOIC D 8 2500 367.0 367.0 35.0
TLV2461CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2461CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2461CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2461CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2461CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2461IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2461IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2461IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2461IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 3