Datasheet
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
2
WWW.TI.COM
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
V
IO
max
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL OUTLINE
(D)
SOT-23
†
(DBV)
SYMBOL
PLASTIC DIP
(P)
0°C to 70°C 2000 µV
TLV2460CD
TLV2461CD
TLV2460CDBV
TLV2461CDBV
VAOC
VAPC
TLV2460CP
TLV2461CP
−40°C to 125°C
2000 µV
TLV2460ID
TLV2461ID
TLV2460IDBV
TLV2461IDBV
VAOI
VAPI
TLV2460IP
TLV2461IP
−40
°
C to 125
°
C
1500 µV
TLV2460AID
TLV2461AID
—
—
—
—
TLV2460AIP
TLV2461AIP
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).
‡
Chip forms are tested at T
A
= 25°C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
SMALL
OUTLINE
†
(PW)
CERAMIC DIP
(JG)
CERAMIC
FLATPACK
(U)
CHIP CARRIER
(FK)
−40°C to 125°C
2000 µV
TLV2460QD
TLV2461QD
TLV2460QPW
TLV2461QPW
—
—
—
—
—
—
−40
°
C to 125
°
C
1500 µV
TLV2460AQD
TLV2461AQD
TLV2460AQPW
TLV2461AQPW
—
—
—
—
—
—
−55°C to 125°C
2000 µV
—
—
—
—
TLV2460MJG
TLV2461MJG
TLV2460MU
TLV2461MU
TLV2460MFK
TLV2461MFK
−55°C to 125°C
1500 µV
—
—
—
—
TLV2460AMJG
TLV2461AMJG
TLV2460AMU
TLV2461AMU
TLV2460AMFK
TLV2461AMFK
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).
TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
MSOP
(DGK)
SYMBOL
MSOP
†
(DGS)
SYMBOL
PLASTIC DIP
(N)
PLASTIC DIP
(P)
0°C to 70°C 2000 µV
TLV2462CD
TLV2463CD
TLV2462CDGK
—
xxTIAAI —
TLV2463CDGS
—
xxTIAAK
—
TLV2463CN
TLV2462CP
—
−40°C to
2000 µV
TLV2462ID
TLV2463ID
TLV2462IDGK
—
xxTIAAJ —
TLV2463IDGS
—
xxTIAAL
—
TLV2463IN
TLV2462IP
—
−40 C to
125°C
1500 µV
TLV2462AID
TLV2463AID
—
—
—
—
—
—
—
—
—
TLV2463AIN
TLV2462AIP
—
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).
‡
Chip forms are tested at T
A
= 25°C only.
Device TLV2465A is Obsolete