Datasheet
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
3
WWW.TI.COM
TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
SMALL
OUTLINE
†
(PW)
CERAMIC DIP
(JG)
CERAMIC
DIP
(J)
CERAMIC
FLATPACK
(U)
CHIP CAR-
RIER
(FK)
−40°C to 125°C
2000 µV
TLV2462QD
TLV2463QD
TLV2462QPW
TLV2463QPW
—
—
—
—
—
—
—
—
−40
°
C to 125
°
C
1500 µV
TLV2462AQD
TLV2463AQD
TLV2462AQPW
TLV2463AQPW
—
—
—
—
—
—
—
—
−55°C to 125°C
2000 µV
—
—
—
—
TLV2462MJG
—
—
TLV2463MJ
TLV2462MU TLV2462MFK
TLV2463MFK
−55°C to 125°C
1500 µV
—
—
—
—
TLV2462AMJG
—
—
TLV2463AMJ
TLV2462AMU TLV2462AMFK
TLV2463AMFK
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS
V
IO
max
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL OUTLINE
(D)
PLASTIC DIP
(N)
TSSOP
(PW)
0°C to 70°C 2000 µV
TLV2464CD
TLV2465CD
TLV2464CN
TLV2465CN
TLV2464CPW
TLV2465CPW
−40°C to 125°C
2000 µV
TLV2464ID
TLV2465ID
TLV2464IN
TLV2465IN
TLV2464IPW
TLV2465IPW
−40
°
C to 125
°
C
1500 µV
TLV2464AID
TLV2465AID
TLV2464AIN
TLV2465AIN
TLV2464AIPW
TLV2465AIPW
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number(e.g., TLV2464CDR).
‡
Chip forms are tested at T
A
= 25°C only.
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
SMALL
OUTLINE
†
(PW)
CERAMIC DIP
(J)
CHIP CARRIER
(FK)
-40°C to 125°C
2000 µV
TLV2464QD
TLV2465QD
TLV2464QPW
TLV2465QPW
—
—
—
—
-40
°
C to 125
°
C
1500 µV
TLV2464AQD
TLV2465AQD
TLV2464AQPW
TLV2465AQPW
—
—
—
—
−55°C to 125°C
2000 µV
—
—
—
—
TLV2464MJ
TLV2465MJ
TLV2464MFK
TLV2465MFK
−55°C to 125°C
1500 µV
—
—
—
—
TLV2464AMJ
TLV2465AMJ
TLV2464AMFK
TLV2465AMFK
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2464QDR).
Device TLV2465A is Obsolete