Datasheet
TLV2442, TLV2442A, TLV2444, TLV2444A
Advanced LinCMOS RAIL-TO-RAIL OUTPUT
WIDE-INPUT-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS169H – NOVEMBER 1996 – REVISED MARCH 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2442 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
TSSOP
(PW)
CERAMIC FLAT
PACK
(U)
0°C to 70°C 2.5 mV TLV2442CD — — TLV2442CPW —
40°Cto85°C
950
µ
V TLV2442AID — — TLV2442AIPW —
–
40°C
to
85°C
µ
2.5 mV
TLV2442ID — — — —
40°Cto125°C
950
µ
V TLV2442AQD — — TLV2442AQPW —
–
40°C
to
125°C
µ
2.5 mV
TLV2442QD — — TLV2442QPW —
55°Cto125°C
950 µV — TLV2442AMFK TLV2442AMJG — TLV2442AMU
–
55°C
to
125°C
µ
2.5 mV
— TLV2442MFK TLV2442MJG — TLV2442MU
The D and PW packages are available taped and reeled. Add R suffix to device type (e.g., TLV2442CDR).
TLV2444 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
TSSOP
(PW)
0°C to 70°C 2.5 mV TLV2444CD TLV2444CPW
40
°
Cto125
°
C
950
µ
V TLV2444AID TLV2444AIPW
–
40°C
to
125°C
µ
2.5 mV
TLV2444ID TLV2444IPW
The D and PW packages are available taped and reeled. Add R suffix to device type (e.g., TLV2444CDR).
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
V
DD –
/GND
V
DD+
2OUT
2IN–
2IN+
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
V
DD–
/GND
V
DD+
2OUT
2IN–
2IN+
NC
V
DD
+
2OUT
2IN –
2IN +
NC
1OUT
1IN –
1IN +
V
DD–
/GND
1
2
3
4
5
10
9
8
7
6
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN–
NC
NC
1IN–
NC
1IN+
NC
NC
1OUT
NC
2IN+
NC
NC
NC
NC
V
DD+
V
DD–
TLV2442
FK PACKAGE
(TOP VIEW)
/GND
NC – No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN–
1IN+
V
DD
+
2IN+
2IN–
2OUT
4OUT
4IN–
4IN+
V
DD–
/GND
3IN+
3IN–
3OUT
(TOP VIEW)
TLV2444
D OR PW PACKAGE
TLV2442
U PACKAGE
(TOP VIEW)
TLV2442
D OR JG PACKAGE
(TOP VIEW)
TLV2442
PW PACKAGE
(TOP VIEW)