Datasheet

TLV2432, TLV2432A, TLV2434, TLV2434A
Advanced LinCMOS RAIL-TO-RAIL OUTPUT
WIDE-INPUT-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS168F NOVEMBER 1996 REVISED MARCH 2001
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLV2432 and TLV2432A AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
TSSOP
(PW)
CERAMIC FLAT
PACK
(U)
0°C to 70°C 2.5 mV TLV2432CD TLV2432CPW
40°Cto85°C
950 µV TLV2432AID TLV2432AIPW
40°C
to
85°C
µ
2.5 mV
TLV2432ID
40
°
Cto125
°
C
950 µV TLV2432AQD
40°C
to
125°C
µ
2.5 mV
TLV2432QD
55
°
Cto125
°
C
950 µV TLV2432AMFK TLV2432AMJG TLV2432AMU
55°C
to
125°C
µ
2.5 mV
TLV2432MFK TLV2432MJG TLV2432MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2432CDR). The PW package is available only left-end taped
and reeled.
TLV2434 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max AT 25°C
SMALL
OUTLINE
(D)
TSSOP
(PW)
0°C to 70°C 2.5 mV TLV2434CD TLV2434CPW
40
°
Cto125
°
C
950 µV TLV2434AID TLV2434AIPW
40°C
to
125°C
µ
2.5 mV
TLV2434ID TLV2434IPW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2434CDR). The
PW package is available only left-end taped and reeled.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN
1IN+
V
DD
+
2IN+
2IN
2OUT
4OUT
4IN
4IN+
V
DD
/GND
3IN+
3IN
3OUT
(TOP VIEW)
TLV2434
D OR PW PACKAGE
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
V
DD
/GND
V
DD+
2OUT
2IN
2IN+
NC
V
DD
+
2OUT
2IN
2IN +
NC
1OUT
1IN
1IN +
V
DD
/GND
1
2
3
4
5
10
9
8
7
6
TLV2432
U PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN+
NC
NC
1OUT
NC
2IN+
NC
NC
NC
NC
V
DD+
V
DD
TLV2432
FK PACKAGE
(TOP VIEW)
/GND
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
V
DD
/GND
V
DD+
2OUT
2IN
2IN+
NC No internal connection
TLV2432
PW PACKAGE
(TOP VIEW)
TLV2432
D OR JG PACKAGE
(TOP VIEW)