Datasheet

TLV2381
TLV2382
SLOS377A – SEPTEMBER 2001– REVISED JULY 2003
11
www.ti.com
APPLICATION INFORMATION
general power dissipation considerations
For a given θ
JA
, the maximum power dissipation is shown in Figure 28 and is calculated by the following formula:
P
D
T
MAX
–T
A
JA
Where:
P
D
= Maximum power dissipation of TLV238x IC (watts)
T
MAX
= Absolute maximum junction temperature (150°C)
T
A
= Free-ambient air temperature (°C)
θ
JA
= θ
JC
+ θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (°C/W)
1
0.75
0.5
0
–55–40 –25 –10 5
Maximum Power Dissipation – W
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35 50
0.25
T
A
– Free-Air Temperature – °C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θ
JA
= 260°C/W
T
J
= 150°C
PDIP Package
Low-K Test PCB
θ
JA
= 104°C/W
SOIC Package
Low-K Test PCB
θ
JA
= 176°C/W
SOT-23 Package
Low-K Test PCB
θ
JA
= 324°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 28. Maximum Power Dissipation vs Free-Air Temperature
3
2
4
5
(TOP VIEW)
1
OUT
GND
IN+
V
DD
IN–
TLV2381
DBV PACKAGE
1
2
3
4
8
7
6
5
NC
IN–
IN+
GND
NC
V
DD
OUT
NC
TLV2381
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
GND
V
DD
2OUT
2IN–
2IN+
TLV2382
D PACKAGE
(TOP VIEW)
NC – No internal connection