Datasheet

  
  µ   
 
SGLS306A − APRIL 2005 − REVISED APRIL 2006
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
FAMILY PACKAGE TABLE
DEVICE
NUMBER OF
PACKAGE TYPES
UNIVERSAL
DEVICE
NUMBER OF
CHANNELS
SOIC SOT-23 TSSOP MSOP
UNIVERSAL
EVM BOARD
TLV2371 1 8 5 — —
See the EVM
TLV2372 2 8 — — 8
See the EVM
Selection Guide
(SLOU060)
TLV2374 4 14 — 14 —
Selection Guide
(SLOU060)
TLV2371 AVAILABLE OPTIONS
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
SOT-23
T
A
25°C
SMALL OUTLINE
(D)
(DBV) SYMBOL
−55°C to 125°C 4.5 mV TLV2371MDREP
†
TLV2371MDBVREP 371E
TLV2372 AVAILABLE OPTIONS
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
MSOP
T
A
25°C
SMALL OUTLINE
(D)
(DGK) SYMBOL
−55°C to 125°C 4.5 mV TLV2372MDREP
†
TLV2372MDGKREP
†
†
Product Preview
TLV2374 AVAILABLE OPTIONS
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25°C
SMALL OUTLINE
(D)
TSSOP
(PW)
−55°C to 125°C 4.5 mV TLV2374MDREP TLV2374MPWREP
†
†
Product Preview
805C 7.4e+07 Hrs (8.4e+03 years)
905C 1.9e+07 Hrs (2.2e+03 years)
1005C 5.3e+06Hrs (6e+02 years)
1105C 1.6e+06Hrs (1.8e+02 years)
1205C 4.9e+05Hrs (56 years)
1305C 1.6e+05Hrs (19 years)
1405C 5.8e+04Hrs (6.6 years)
Time-to-Fail − Hrs
80 90 100 110 120 130 140 150
1e+08
1e+09
1e+07
1e+06
100000
10000
Degrees C Continuous T
J
Figure 1. Wirebond Life Plot