Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9688201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9688201Q2A
TLV2354
MFKB
5962-9688201QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9688201QC
A
TLV2354MJB
5962-9688201QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9688201QD
A
TLV2354MWB
TLV2354ID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TLV2354I
TLV2354IDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TLV2354I
TLV2354IDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TLV2354I
TLV2354IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TLV2354I
TLV2354IN ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLV2354IN
TLV2354INE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLV2354IN
TLV2354IPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2354
TLV2354IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2354
TLV2354IPWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 85
TLV2354IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2354
TLV2354IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2354
TLV2354MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9688201Q2A
TLV2354
MFKB