Datasheet

TLV2352, TLV2352Y
LinCMOS DUAL LOW-VOLTAGE DIFFERENTIAL COMPARATORS
SLCS011B – MAY 1992 – REVISED MARCH 1999
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2352Y chip information
These chips, when properly assembled, display characteristics similar to the TLV2352. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
OUT
IN+
IN–
V
DD
GND
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
IN+
IN–
OUT
(4)
57
57
(7)
(6)
(5)
(8)
(4)
(3)(2)(1)