Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9688101Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9688101Q2A
TLV2352
MFKB
5962-9688101QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9688101QHA
TLV2352M
5962-9688101QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9688101QPA
TLV2352M
TLV2352ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 2352I
TLV2352IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 2352I
TLV2352IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 2352I
TLV2352IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 2352I
TLV2352IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLV2352IP
TLV2352IPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLV2352IP
TLV2352IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2352
TLV2352IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2352
TLV2352IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85
TLV2352IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2352
TLV2352IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TY2352
TLV2352MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9688101Q2A
TLV2352
MFKB
TLV2352MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLV2352MJG