Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2332IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2332IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLV2334IPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2