Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV2262ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262I
TLV2262IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262I
TLV2262IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262I
TLV2262IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262I
TLV2262IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2262IP
TLV2262IPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2262IP
TLV2262IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2262
TLV2262IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2262
TLV2262IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2262
TLV2262IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY2262
TLV2262MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9550401Q2A
TLV2262
MFKB
TLV2262MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9550401QPA
TLV2262M
TLV2262MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9550401QHA
TLV2262M
TLV2262QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2262Q
TLV2262QDG4 ACTIVE SOIC D 8 1500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2262Q
TLV2262QDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2262Q
TLV2262QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2262Q
TLV2264AID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2264AI