Datasheet

 
  
   

SLOS185D − FEBRUARY 1997 − REVISED AUGUST 2006
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2252 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
‡
(PW)
CERAMIC
FLATPACK
(U)
−40°C to 125°C
850 µV
TLV2252AID
—
—
TLV2252AIP
TLV2252AIPWLE
—
−40°C to 125°C
850 µV
1500 µV
TLV2252AID
TLV2252ID
—
—
—
—
TLV2252AIP
TLV2252IP
TLV2252AIPWLE
—
—
—
−40°C to 125°C
850 µV
TLV2252AQD
—
—
—
—
—
−40°C to 125°C
850 µV
1500 µV
TLV2252AQD
TLV2252QD
—
—
—
—
—
—
—
—
—
—
−55°C to 125°C
850 µV
1500 µV
—
—
TLV2252AMFK
TLV2252MFK
TLV2252AMJG
TLV2252MJG
—
—
—
—
TLV2252AMU
TLV2252MU
†
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2252CDR).
‡
The PW package is available only left-end taped and reeled.
§
Chips are tested at 25°C.
TLV2254 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
‡
(PW)
CERAMIC
FLATPACK
(W)
−40°C to 125°C
850 µV
TLV2254AID
—
—
TLV2254AIN
TLV2254AIPWLE
—
−40°C to 125°C
850 µV
1500 µV
TLV2254AID
TLV2254ID
—
—
—
—
TLV2254AIN
TLV2254IN
TLV2254AIPWLE
—
—
—
−40°C to 125°C
850 µV
TLV2254AQD
—
—
—
—
—
−40°C to 125°C
850 µV
1500 µV
TLV2254AQD
TLV2254QD
—
—
—
—
—
—
—
—
—
—
−55°C to 125°C
850 µV
1500 µV
—
—
TLV2254AMFK
TLV2254MFK
TLV2254AMJ
TLV2254MJ
—
—
—
—
TLV2254AMW
TLV2254MW
†
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2254CDR).
‡
The PW package is available only left-end taped and reeled.
§
Chips are tested at 25°C.