Datasheet
SLOS156E − MAY 1996 − REVISED SEPTEMBER 2006
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2211C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (2) IS INTERNALLY CONNECTED
TO
BACK
SIDE
OF
CHIP.
+
−
OUT
IN+
IN−
V
DD+
(5)
(1)
(3)
(4)
(2)
V
DD−
/GND
40
(3)
(2)
(1)
(5)
(4)
32