Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV0834CDR SOIC D 14 2500 367.0 367.0 38.0
TLV0834CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV0834IDR SOIC D 14 2500 367.0 367.0 38.0
TLV0834IPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV0838CDWR SOIC DW 20 2000 367.0 367.0 45.0
TLV0838CPWR TSSOP PW 20 2000 367.0 367.0 38.0
TLV0838IDWR SOIC DW 20 2000 367.0 367.0 45.0
TLV0838IPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jan-2013
Pack Materials-Page 2