Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsData collecting ICsData acquisition IC - AD converter (ADC) External SOIC 8

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 

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SLAS148 − SEPTEMBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

D 8-Bit Resolution

D 2.7 V to 3.6 V V

D Easy Microprocessor Interface or

Standalone Operation

D Operates Ratiometrically or With V

Reference

D Single Channel or Multiplexed Twin

Channels With Single-Ended or Differential

Input Options

D Input Range 0 V to V

With V

Reference

D Inputs and Outputs Are Compatible With

TTL and MOS

D Conversion Time of 32 µs at

(CLK)

= 250 kHz

D Designed to Be Functionally Equivalent to

the National Semiconductor ADC0831 and

ADC0832 at 3 V Supply

D Total Unadjusted Error . . . ± 1 LSB

description

These devices are 8-bit successive-approximation analog-to-digital converters. The TLV0831 has single input

channels; the TLV0832 has multiplexed twin input channels. The serial output is configured to interface with

standard shift registers or microprocessors.

The TLV0832 multiplexer is software configured for single-ended or differential inputs. The differential analog

voltage input allows for common-mode rejection or offset of the analog zero input voltage value. In addition, the

voltage reference input can be adjusted to allow encoding any smaller analog voltage span to the full 8 bits of

resolution.

The operation of the TLV0831 and TLV0832 devices is very similar to the more complex TLV0834 and TLV0838

devices. Ratiometric conversion can be attained by setting the REF input equal to the maximum analog input

signal value, which gives the highest possible conversion resolution. Typically, REF is set equal to V

(done

internally on the TLV0832).

The TLV0831C and TLV0832C are characterized for operation from 0°C to 70°C. The TLV0831I and TLV0832I

are characterized for operation from −40°C to 85°C.

AVAILABLE OPTIONS

PACKAGE

SMALL OUTLINE

(D)

PLASTIC DIP

(P)

0°C to 70°C TLV0831CD TLV0832CD TLV0831CP TLV0832CP

−40°C to 85°C TLV0831ID TLV0832ID TLV0831IP TLV0832IP

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

IN+

IN−

GND

CLK

REF

TLV0831 ...D OR P PACKAGE

(TOP VIEW)

CH0

CH1

GND

/REF

CLK

TLV0832 ...D OR P PACKAGE

(TOP VIEW)

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Summary of content (20 pages)

PAGE 1
SLAS148 − SEPTEMBER 1996 D 8-Bit Resolution D 2.7 V to 3.6 V VCC D Easy Microprocessor Interface or D D D D D D D TLV0831 . . .
PAGE 2
SLAS148 − SEPTEMBER 1996 functional block diagram Start Flip-Flop CLK CS CLK Shift Register DI ODD/EVEN D (TLV0832 only) S R Start CLK To Internal Circuits CLK SGL/DIF CH0/IN+ CH1/IN − Analog MUX S R Time Delay Comparator EN CS CS CS CS CS EN REF (TLV0831 only) Ladder and Decoder Bits 0−7 R EN SAR Logic and Latch CLK Bits 0−7 Bit 1 MSB First 9-Bit Shift Register LSB First One Shot 2 •
PAGE 3
SLAS148 − SEPTEMBER 1996 functional description The TLV0831 and TLV0832 use a sample-data-comparator structure that converts differential analog inputs by a successive-approximation routine. The input voltage to be converted is applied to an input terminal and is compared to ground (single ended), or to an adjacent input (differential).
PAGE 4
SLAS148 − SEPTEMBER 1996 sequence of operation TLV0831 1 2 3 4 5 6 7 8 9 10 CLK tsu tconv CS MSB-First Data MUX Settling Time Hi-Z DO MSB 7 Hi-Z LSB 6 5 4 3 2 1 0 TLV0832 1 2 3 4 5 6 10 11 12 13 14 18 19 20 21 CLK tconv tsu CS +Sign Bit Start Bit SGL ODD DI (TLV0832 only) Don’t Care DIF EVEN MSB-First Data LSB-First Data MUX Settling Time DO Hi-Z MSB 7 LSB 6 2 1 MSB
PAGE 5
SLAS148 − SEPTEMBER 1996 absolute maximum ratings over recommended operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V Input voltage range, VI: Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
PAGE 6
SLAS148 − SEPTEMBER 1996 electrical characteristics over recommended range of operating free-air temperature, VCC = 3.3 V, f(CLK) = 250 kHz (unless otherwise noted) digital section C SUFFIX MIN TYP‡ MAX TEST CONDITIONS† PARAMETER VCC = 3 V, VCC = 3 V, IOH = − 360 µA IOH = − 10 µA VCC = 3 V, VIH = 3.6 V IOL = 1.
PAGE 7
SLAS148 − SEPTEMBER 1996 operating characteristics VCC = Vref = 3.
PAGE 8
SLAS148 − SEPTEMBER 1996 PARAMETER MEASUREMENT INFORMATION VCC CLK 50% 50% GND VCC tsu tsu CLK VCC 50% GND CS tpd 0.4 V GND th 2V VOH th DO 50% VOL VCC 2V DI 0.4 V 0.4 V Figure 2. Data-Output Timing GND Figure 1.
PAGE 9
SLAS148 − SEPTEMBER 1996 TYPICAL CHARACTERISTICS UNADJUSTED OFFSET ERROR vs REFERENCE VOLTAGE LINEARITY ERROR vs REFERENCE VOLTAGE 1.5 VCC = 3.3 V f(CLK) = 250 kHz TA = 25°C VI+ = VI − = 0 V 14 1.25 12 E L − Linearity Error − LSB EO(unadj) − Unadjusted Offset Error − LSB 16 10 8 6 4 1.0 0.75 0.5 0.25 2 0 0.01 0.1 1.
PAGE 10
SLAS148 − SEPTEMBER 1996 TYPICAL CHARACTERISTICS TLV0831 TLV0831 SUPPLY CURRENT vs FREE-AIR TEMPERATURE SUPPLY CURRENT vs CLOCK FREQUENCY 0.3 0.5 f(CLK) = 250 kHz CS = High VCC = 3.3 V TA = 25°C 0.4 I CC − Supply Current − mA I CC − Supply Current − mA VCC = 3.6 V VCC = 3.3 V 0.2 VCC = 3 V 0.3 0.2 0.1 0.
PAGE 11
SLAS148 − SEPTEMBER 1996 Differential Nonlinearity − LSB TYPICAL CHARACTERISTICS 1 0.5 0 Vref = 3.3 V TA = 25°C F(CLK) = 250 kHz VDD = 3.3 V −0.5 −1 0 32 64 96 128 160 192 224 256 224 256 Output Code Figure 11. Differential Nonlinearity With Output Code Integral Nonlinearity − LSB 1 Vref = 3.3 V TA = 25°C F(CLK) = 250 kHz VDD = 3.3 V 0.5 0 −0.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV0831CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV0831IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV0832CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV0832IDR SOIC D 8 2500 330.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV0831CDR SOIC D 8 2500 367.0 367.0 35.0 TLV0831IDR SOIC D 8 2500 367.0 367.0 35.0 TLV0832CDR SOIC D 8 2500 367.0 367.0 35.0 TLV0832IDR SOIC D 8 2500 367.0 367.0 35.
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