Datasheet

TLK3101
2.5 Gbps to 3.125 Gbps TRANSCEIVER
SCAS649B − AUGUST 2000 − REVISED JANUARY 2008
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
thermal characteristics
PARAMETER TEST CONDITION MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
21.47
R
θ
JA
Junction-to-free-air
thermal resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
42.20
°C/W
Board-mounted, no air flow, JEDEC test board 75.83
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
0.38
R
θ
JC
Junction-to-case thermal
resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
0.38
°C/W
Board-mounted, no air flow, JEDEC test board 7.8