Datasheet

TLK2711A
www.ti.com SLLS908B –JULY 2008–REVISED OCTOBER 2012
THERMAL INFORMATION
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Board-mounted, no air flow, high conductivity TI recommended test
21.47
board, chip soldered or greased to thermal land
Junction-to-free-air Board-mounted, no air flow, high conductivity TI recommended test
R
θJA
°C/W
thermal resistance board with thermal land but no solder or grease thermal connection to 42.20
thermal land
Board-mounted, no air flow, JEDEC test board 75.88
Board-mounted, no air flow, high conductivity TI recommended test
0.38
board, chip soldered or greased to thermal land
Junction-to-case Board-mounted, no air flow, high conductivity TI recommended test
R
θJC
°C/W
thermal resistance board with thermal land but no solder or grease thermal connection to 0.38
thermal land
Board-mounted, no air flow, JEDEC test board 7.8
APPLICATION INFORMATION
Figure 10. External Component Interconnection
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